发明名称 THERMOSETTING RESIN COMPOSITION, AND THERMOSETTING RESIN MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition capable of remarkably controlling the generation of formaldehyde and useful for producing molds, etc., by including a thermosetting resin with a specific compound. SOLUTION: This thermosetting resin composition is obtained by including (A) a thermosetting resin containing formaldehyde (preferably a phenolic resin, a urea resin, a melamine resin, etc.), with (B) at least one compound selected from a compound of formula I [X is O or S; R1-R4 are each H, a 1-8C (substituted) alkyl, a 3-8C (substituted) cycloalkyl or the like] and a compound of formula II [R5-R9 are each H, a 1-8C (substituted) alkyl, a 3-8C (substituted) cycloalkyl or the like] (for example, hydrazodicarbonamide) in an amount of 0.1-10 wt.%.
申请公布号 JP2000080247(A) 申请公布日期 2000.03.21
申请号 JP19990219239 申请日期 1999.08.02
申请人 OTSUKA CHEM CO LTD 发明人 TOMOTAKI YOSHIHISA;KAMIYA KAZUSAKI;ABE YOSHINOBU
分类号 C08L61/00;C08K5/24;C08L65/00;C08L71/14;C08L75/02;(IPC1-7):C08L61/00 主分类号 C08L61/00
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