发明名称 |
SILICONE ADHESIVE SHEET, ITS MANUFACTURE AND SEMICONDUCTOR DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a silicone adhesive sheet having excellent handling and working properties and excellent adhesion properties, a method for efficiently manufacturing such a silicone adhesive sheet, and a reliable semiconductor device mounting a semiconductor chip at a chip-attaching portion by means of the silicone adhesive sheet. SOLUTION: This silicone adhesive sheet comprises a crosslinkable silicone composition crosslinked between substrates having a release property against the crosslinked product of the composition. In a method for manufacturing the silicone adhesive sheet, at least one of the substrates has an oxygen atom and/or sulfur atom at the surface in contact with the composition, and a semiconductor device has a semiconductor chip mounted on a chip-attaching portion by means of the silicone adhesive sheet.</p> |
申请公布号 |
JP2000080335(A) |
申请公布日期 |
2000.03.21 |
申请号 |
JP19980250593 |
申请日期 |
1998.09.04 |
申请人 |
DOW CORNING TORAY SILICONE CO LTD |
发明人 |
YAMAKAWA KIMIO;ISSHIKI MINORU;OTANI YOSHIKO;MINE KATSUTOSHI |
分类号 |
H01L21/52;C09J7/00;C09J7/02;C09J183/07;(IPC1-7):C09J7/02 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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