发明名称 SILICONE ADHESIVE SHEET, ITS MANUFACTURE AND SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a silicone adhesive sheet having excellent handling and working properties and excellent adhesion properties, a method for efficiently manufacturing such a silicone adhesive sheet, and a reliable semiconductor device mounting a semiconductor chip at a chip-attaching portion by means of the silicone adhesive sheet. SOLUTION: This silicone adhesive sheet comprises a crosslinkable silicone composition crosslinked between substrates having a release property against the crosslinked product of the composition. In a method for manufacturing the silicone adhesive sheet, at least one of the substrates has an oxygen atom and/or sulfur atom at the surface in contact with the composition, and a semiconductor device has a semiconductor chip mounted on a chip-attaching portion by means of the silicone adhesive sheet.</p>
申请公布号 JP2000080335(A) 申请公布日期 2000.03.21
申请号 JP19980250593 申请日期 1998.09.04
申请人 DOW CORNING TORAY SILICONE CO LTD 发明人 YAMAKAWA KIMIO;ISSHIKI MINORU;OTANI YOSHIKO;MINE KATSUTOSHI
分类号 H01L21/52;C09J7/00;C09J7/02;C09J183/07;(IPC1-7):C09J7/02 主分类号 H01L21/52
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