| 摘要 |
A plurality of polishing pads and methods for mechanical and/or chemical-mechanical planarization of substrate assemblies with the polishing pads in the fabrication of microelectronic devices. In one embodiment, a polishing pad has a suspension medium with an exposed surface configured to face toward a substrate holder of a planarizing machine, and a plurality of reaction control elements in the suspension medium. The reaction control elements are bonded to the suspension medium in a fixed distribution across at least a portion of the exposed surface of the suspension medium to define at least a portion of a planarizing surface of the polishing pad. The reaction control elements are preferably soluble in the planarizing fluid to impart a chemical to the planarizing fluid that interacts with the substrate assembly for controlling removal of material from the substrate assembly. For example, the reaction control elements are generally oxidants, inhibitors, wetting agents, surfactants and/or other chemicals that are typically a component of the planarizing fluid before the planarizing fluid is deposited onto the planarizing surface. In a preferred embodiment, the polishing pad further includes a plurality of abrasive particles fixedly attached to the suspension medium in addition to the reaction control elements.
|
