发明名称 Method of manufacturing semiconductor devices
摘要 A microscopic interconnection pattern and a gate electrode can be prevented from being deformed when a first region requiring high temperature heating, such as a source-drain region and a second region which should be prevented from being heated at high temperature, such as a microscopic interconnection pattern and a gate electrode are formed on the same semiconductor substrate. A first region which requires high temperature heating and a second region which should be avoided from being heated at high temperature are formed on a semiconductor substrate. In that case, the second region is composed of a narrow portion (1) and wide portions (2) wider than the narrow portion (1) formed on respective ends of the narrow portion 1. Then, the semiconductor substrate is photo-annealed.
申请公布号 US6040224(A) 申请公布日期 2000.03.21
申请号 US19970841626 申请日期 1997.04.30
申请人 SONY CORPORATION 发明人 TSUKAMOTO, HIRONORI
分类号 H01L29/78;H01L21/265;H01L21/268;H01L21/336;H01L29/423;(IPC1-7):H01L21/265 主分类号 H01L29/78
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