| 摘要 |
The invention relates to a device for soldering or unsoldering components, especially BGA components, arranged on a circuit support. A sealed housing (1) is provided for accommodating the circuit support (12). Supporting means (17) for supporting the circuit support (12) are provided for positioning the circuit support (12) between two opposite walls (3, 4) of the housing (1) while forming at least two air channels (27, 28). A means for heating and producing an airflow is arranged in an area of a front wall (5) of the housing (1) in such a way that an airflow which is directed in a parallel manner in relation to the span of the circuit support (12) is guided in one of the air channels (27, 28). In the vicinity of the front wall (5), at least one air outlet opening (24) is arranged on one side of the longitudinal mid-plane (14) of the housing (1), said side facing away from the means for heating and producing an airflow.
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