| 摘要 |
The component carrier is a board (6), esp. using Moulded Interconnected Device technology, with electrically conducting tracks (4) and at least one component (1) with electrical connections (5) mounted on the board so that the connections are in contact with associated tracks. The board has openings (7) approximately corresp. to the component connections and in electrical contact with the corresp. tracks. The openings have conducting surfaces (8) and the openings and/or connections are made in the form of plug contacts (9) so that the component with its connections can be plugged into and/or on the openings on the board in a clamped electrically connecting manner.
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