发明名称 |
METHOD FOR PLATING SUBSTRATE AND APPARATUS |
摘要 |
A method for plating a substrate for the copper damascene wiring which comprises plating with copper a surface of a substrate having fine slots and holes for wiring formed thereon, to thereby fill the slots and holes with a plated copper layer, wherein an electrolytic plating is carried out by using a plating liquid having concentrations of copper sulfate (CuSO4.5H2O), sulfuric acid (H2SO4) and chloride ion of 4 to 250 g/l, 10 to 200 g/l, 0 to 100 mg/l, respectively. Further, a copper plating bath being more preferable and more suitable to the copper damascene method is provided by adding a sulfur compound in a concentration selected according to the ratio of sulfuric acid / copper sulfate pentahydrate. This method can be used for plating with copper fine slots and holes formed on a substrate for copper damascene wiring with efficiency while preventing the generation of a foam, without the need for a specific machine or electrical facility. |
申请公布号 |
WO0014306(A1) |
申请公布日期 |
2000.03.16 |
申请号 |
WO1999JP04797 |
申请日期 |
1999.09.03 |
申请人 |
EBARA CORPORATION;NAGAI, MIZUKI;HONGO, AKIHISA;OHNO, KANJI;ISHII, KAZUO;KIMIZUKA, RYOICHI;MARUYAMA, MEGUMI |
发明人 |
NAGAI, MIZUKI;HONGO, AKIHISA;OHNO, KANJI;ISHII, KAZUO;KIMIZUKA, RYOICHI;MARUYAMA, MEGUMI |
分类号 |
C23C18/16;C23C18/38;C25D3/38;C25D7/12;H01L21/288;H01L21/768;(IPC1-7):C25D3/38;H05K3/40;H05K3/18;C25D7/00;C25D3/101 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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