| 摘要 |
<p>The present disclosure relates to a polishing pad (20) inlcuding a pad structure having at least first and second polishing regions (22, 24, 26) defined along a polishing surface (36) of the pad structure. The first polishing region of the pad structure is less compressible than the second polishing region of the pad structure. The present disclosure also relates to a polish platen (46) including a platen structure having at least first and second regions adapted for supporting a polishing pad (20). The first region of the platen structure is less compressible than the second region of the platen structure.</p> |
