| 摘要 |
PROBLEM TO BE SOLVED: To give a good optical characteristic to a solid image pickup device and improve its mass productivity and make it cheap, by capturing foreign matters on the chip being mixed in its manufacturing process, and preventing especially adhesion of foreign matters on the light receiving portion. SOLUTION: In a solid image pickup device 1 comprising a light receiving element 8 and a transfer gate element, etc., using the well-known PR (photoresist) technique in the diffusion process stage of its wafer, an adhesive film 13 is provided on its surface other than the light receiving portion 8 on its chip to make possible easily the captures of foreign matters 9 on its chip. Since the adhesive film 13 is present on its chip surface other than the light receiving portion 8 present on its chip, the movements of the foreign matters 9 to the light receiving portion 8 are eliminated to aloid damage to its optical characteristic. |
