| 摘要 |
<p>A method for plating a substrate for the copper damascene wiring which comprises plating with copper a surface of a substrate having fine slots and holes for wiring formed thereon, to thereby fill the slots and holes with a plated copper layer, wherein an electrolytic plating is carried out by using a plating liquid having concentrations of copper sulfate (CuSO4.5H2O), sulfuric acid (H2SO4) and chloride ion of 4 to 250 g/l, 10 to 200 g/l, 0 to 100 mg/l, respectively. Further, a copper plating bath being more preferable and more suitable to the copper damascene method is provided by adding a sulfur compound in a concentration selected according to the ratio of sulfuric acid / copper sulfate pentahydrate. This method can be used for plating with copper fine slots and holes formed on a substrate for copper damascene wiring with efficiency while preventing the generation of a foam, without the need for a specific machine or electrical facility.</p> |
