| 摘要 |
The invention relates to a method for applying a circuit chip (6) onto a circuit substrate (8), said circuit chip being placed on an auxiliary substrate (2). First of all, the circuit chip which is placed on the auxiliary substrate (2) is provided on the wafer (2) or on a flexible film (30). Afterwards, a circuit substrate (8), on or in which the circuit chip (6) should be placed, is positioned on the surface of the circuit chip (6) facing away from the auxiliary substrate (2) by changing the position of the circuit substrate (8). This can be achieved by deforming a flexible substrate transport device (20). The circuit chip (6) is then detached from the auxiliary substrate (2) and is applied onto the circuit substrate (8). Finally, the circuit substrate (8) with the circuit chip (6) is removed from the auxiliary substrate (2) by changing the position of the circuit substrate (8) and/or of the auxiliary substrate (2). |
