发明名称 |
Light valve packing arrangement used in the manufacture of liquid crystal displays has bond wires connected to flexible circuit on substrate |
摘要 |
Arrangement comprises: soft adhesive layer (24) on upper side of substrate (22) having suitable thermal expansion coefficient; silicon light valve with silicon rear side (20); flexible circuit (26) with opening exposing light valve; bond wires (28) connected to circuit; metal cladding on circuit; and soft metal cladding layer (32) partially covering light valve and completely covering bond wires. An Independent claim is also included for a process for the production of the light valve packing arrangement. |
申请公布号 |
DE19923514(A1) |
申请公布日期 |
2000.03.16 |
申请号 |
DE1999123514 |
申请日期 |
1999.05.21 |
申请人 |
NATIONAL SEMICONDUCTOR CORP. |
发明人 |
PENRY, MATTHEW D. |
分类号 |
G02F1/03;G02F1/13;(IPC1-7):G02F1/136;G02F1/133 |
主分类号 |
G02F1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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