发明名称 Light valve packing arrangement used in the manufacture of liquid crystal displays has bond wires connected to flexible circuit on substrate
摘要 Arrangement comprises: soft adhesive layer (24) on upper side of substrate (22) having suitable thermal expansion coefficient; silicon light valve with silicon rear side (20); flexible circuit (26) with opening exposing light valve; bond wires (28) connected to circuit; metal cladding on circuit; and soft metal cladding layer (32) partially covering light valve and completely covering bond wires. An Independent claim is also included for a process for the production of the light valve packing arrangement.
申请公布号 DE19923514(A1) 申请公布日期 2000.03.16
申请号 DE1999123514 申请日期 1999.05.21
申请人 NATIONAL SEMICONDUCTOR CORP. 发明人 PENRY, MATTHEW D.
分类号 G02F1/03;G02F1/13;(IPC1-7):G02F1/136;G02F1/133 主分类号 G02F1/03
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