| 摘要 |
<p>A highly reliable electronic part module mounted on a motherboard is realized by various means. Specifically, a structure for holding pins is provided to prevent the pins from being bend, the pinsare commonly used to reduce the man-hour of the pin planting process, a build-up layer is exploited to reduce the man-hour of the soldering process, an interlayer connection structure is provided in the layer bonding structure so as to ensure the interlayer connnection, and a socket structure is provided in a conversion board, thus realizing an extremely-simple highly-reliable electronic part module.</p> |
