SEMICONDUCTOR DEVICES HAVING A PAD FOR PROBING AND METHOD THEREOF

摘要

PURPOSE: A semiconductor device and method thereof are provided to reduce a probing resistance and prevent a crack by differencing the thickness of an insulator formed at lower part of the pad. CONSTITUTION: The semiconductor device having pads comprises a first metal pad layer (50) having a plurality of holes (54) and formed on a semiconductor substrate; a second metal pad layer (56) having a plurality of second holes (60) formed at edge portion of the second pad layer and connected to the first metal pad layer (50) via the first holes (54); an insulating layer (58) formed on the second metal pad (56), wherein the thickness of the probed region (A) in the insulating layer (58) is thicker than that of the region being not to be probing; and a pad (62) for probing and connected to the second metal pad layer (56) via the second holes (60).