CURING METHOD OF LIQUID PHASE SEALING MATERIAL FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A curing method of liquid phase sealing material for semiconductor package is provide to reduce the number of manufacturing process and enhance productivity by combining two processes of the void removing process and the curing process into one process. CONSTITUTION: The curing method of liquid phase sealing material for semiconductor package comprises: a step coating the wire bonding portion of the material with liquid sealing material and inserting it into a vacuum chamber; a step removing the voids within said sealing material by using the vacuum state of said vacuum chamber; and a step heating said sealing material to cure it after releasing the vacuum state within said vacuum chamber.