SEMICONDUCTOR DEVICE COMPRISING A GLASS SUPPORTING BODY ONTO WHICH A SUBSTRATE WITH SEMICONDUCTOR ELEMENTS AND A METALLIZATION IS ATTACHED BY MEANS OF AN ADHESIVE

摘要

A thin film semiconductor device includes a glass supporting body having thereon an insulating substrate which is attached thereto by a layer of adhesive material. On the surface of the substrate facing the supporting body is a layer of semiconductor material which includes therein a semiconductor element, such surface further having thereon a metalization pattern of conductor tracks. An insulating layer is additionally provided between the metalization pattern and the adhesive layer, and has a dielectric constant epsir below 3 and a thickness in the range of approximately 20 mum to 60 mum. By virtue of such additional layer, parasitic capacitanees between the metalization pattern and an envelope in which the device is included or a printed circuit board on which the device is mounted are reduced substantially, thereby reducing the power consumption of the device.