Mounting optoelectronic devices on lead frames

摘要

An assembly comprising an integrated silicon chip 11 mounted on a substate 16 is connected to a lead frame via solder bumps 18 positioned at the edges of the substrate. The solder bumps are connected by leads 17 to optoelectronic devices 13 such as laser diodes or photo diodes. Waveguides 12 couple the diodes to an optical fibre 14. After mounting the assembly on a support frame, heat and pressure are applied to connect the solder bumps to the lead frame. The support frame is then filled with silicone and/or epoxy resin to encapsulate the assembly.