METHOD FOR POLISHING AN WAFER

摘要

PURPOSE: A wafer polishing method is provided to prevent a failure of the polishing apparatus and breaking of the wafer by rotating the wafer and moving the residuals into an edge of wafer. CONSTITUTION: The polishing method comprises the steps of: loading of a wafer (12) on a chuck table (10); polishing the wafer (12) formed on the chuck table (10); rotating the wafer (12) in order to move the polished residuals (30) into the wafer edge; and moving the wafer (12) onto another chuck table using a vacuum arm (16) on the wafer, thereby preventing entrance of the polished residuals (30) remained on the wafer (12).