发明名称 |
METHOD FOR FORMING A SILICIDED SELF-ALIGNED CONTACT |
摘要 |
PURPOSE: A method for forming a silicided self-aligned contact is provided, which forms a silicided gate and source/drain without an additional photo process and successively forms a self-aligned contact. CONSTITUTION: The method for forming a silicided self-aligned contact comprises the steps of: forming a gate mask layer (106) and a gate spacer (110) as a material having an etch selectivity; selectively removing the gate mask layer (106) to the gate spacer (110); forming a silicide film (114a) on a gate conductive film (105) using a silicide process; successively depositing a material having an etching selectivity with the gate spacer (110) and a layer insulating film (118) on a front surface of a semiconductor substrate (100); and successively etching the layer insulating film (118) and the material layer (116) and forming a contact hole (122). Thereby, it is possible to successively form the self-aligned contact without the additional photo process.
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申请公布号 |
KR20000015465(A) |
申请公布日期 |
2000.03.15 |
申请号 |
KR19980035392 |
申请日期 |
1998.08.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN, YU-CHEOL |
分类号 |
H01L21/28;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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