发明名称 METHOD FOR FORMING A SILICIDED SELF-ALIGNED CONTACT
摘要 PURPOSE: A method for forming a silicided self-aligned contact is provided, which forms a silicided gate and source/drain without an additional photo process and successively forms a self-aligned contact. CONSTITUTION: The method for forming a silicided self-aligned contact comprises the steps of: forming a gate mask layer (106) and a gate spacer (110) as a material having an etch selectivity; selectively removing the gate mask layer (106) to the gate spacer (110); forming a silicide film (114a) on a gate conductive film (105) using a silicide process; successively depositing a material having an etching selectivity with the gate spacer (110) and a layer insulating film (118) on a front surface of a semiconductor substrate (100); and successively etching the layer insulating film (118) and the material layer (116) and forming a contact hole (122). Thereby, it is possible to successively form the self-aligned contact without the additional photo process.
申请公布号 KR20000015465(A) 申请公布日期 2000.03.15
申请号 KR19980035392 申请日期 1998.08.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIN, YU-CHEOL
分类号 H01L21/28;(IPC1-7):H01L21/28 主分类号 H01L21/28
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