| 摘要 |
A description is given of a method of manufacturing an inductive element for SMD applications. This method comprises the following steps: a) providing a number of predominantly parallel electroconductive wires in the mould of an injection-moulding device, b) circumferentially providing a part of the wires with a synthetic resin by injection moulding, in such a manner that the ends of the wires remain free, c) providing an envelope of a soft-magnetic material around the circumferentially injection moulded part of the wires, and d) reshaping the ends of the wires. In accordance with the invention, the method is characterized in that the parts of the wires to be circumferentially injection moulded are fixed inside the mould during the injection moulding process. It has been found that inductive elements of the type manufactured in accordance with the inventive method generate, in operation, optimally homogeneous magnetic fields. Also the risk of electric short-circuits proves to be small. <IMAGE> |
