发明名称 Bonding to nickel-titanium alloy
摘要 <p>A joint and a laminate including a nickel-titanium alloy such as Nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying a halogen containing flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein and deposits a metal from the halogen containing flux on the oxidation free surface. The activated flux also coats the member surface for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the tinned surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the metal from the halogen containing flux, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetween.</p>
申请公布号 EP0642876(B1) 申请公布日期 2000.03.15
申请号 EP19940306229 申请日期 1994.08.24
申请人 COOK INCORPORATED 发明人 HALL, TODD A.
分类号 B23K1/19;B23K1/20;B23K35/00;B23K35/34;B23K35/36;B23K35/363;(IPC1-7):B23K35/00 主分类号 B23K1/19
代理机构 代理人
主权项
地址