SOLDER BALL BUMPING METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A solder ball bumping method is provided to reduce the operation time by producing a solder ball bumping tool having the same size with a wafer and by solder ball bumping the whole wafer at a time. CONSTITUTION: A solder ball bumping method comprising the steps of: wire bonding, encapsulating and solder ball bumping as a circuit tape where a circuit pattern is formed is stuck to a wafer(1) where a number of semiconductor chips(2), and cutting the wafer into the each semiconductor chip, wherein the solder ball bumping step is consisted of the steps of producing a solder ball bumping tool(4) in the same size with the wafer(1) and bumping the over all semiconductor chips(2) formed on the wafer(1) at a time.