SEMICONDUCTOR DEVICE

摘要

Disclosed is a semiconductor device comprising an integrated circuit chip (11), a first lead (15A) having a portion extending substantially in parallel to one side plurality of the chip (11), and a second lead (15B) located adjacent to the first lead (15A). Each of the first and second leads (15A, 15B) has a recess and a projection (19) continuously. The first lead (15A) and second lead (15B) are arranged adjacent to each other with the recess and projection (19) of the first lead (15A) being in engagement with the projection (19) and recess of the second lead (15B). Bonding wires (18) are bonded on the projection (19) of the first lead (15A) and the projection (19) of the second lead (15B). The bonding wires (18) electrically connect the chip (11) to the first lead (15A) and also to the second lead (15B).