APPARATUS FOR CHEMICAL MECHANICAL POLISHING

摘要

PURPOSE: A CMP(chemical mechanical polishing) apparatus is provided to achieve a uniform profile of a polishing pad by using a sectored-shaped end-effector. CONSTITUTION: The apparatus comprises a polishing pad for polishing a wafer and an end-effector (100) having a sectored structure for conditioning the polishing pad. The bottom face of the end-effector, that is the contact part between the polishing pad and the end-effector (100) has comb patterns. The sectored shaped end effector (100) further comprises a plurality of holes (102) for spraying a water and a bar (104) for controlling the profile of the pads.