发明名称 |
CAPACITOR AND FORMING METHOD THEROF |
摘要 |
PURPOSE: A capacitor and forming method thereof is provided to solve problem of micro-loading, increase a conductive region, and simplify manufacturing process. CONSTITUTION: A substrate comprises two gates and a common source/drain region. A part of the common source/drain region is exposed by forming a pitted self align contact window(PSACW) using self align contact process. A glue/barrier layer and a lower electrode of a capacitor are formed on the pitted self contact window. A dielectric thin film is formed on a lower electrode. An upper electrode is formed on the dielectric thin film.
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申请公布号 |
KR20000015040(A) |
申请公布日期 |
2000.03.15 |
申请号 |
KR19980034728 |
申请日期 |
1998.08.26 |
申请人 |
UNITED MICROELECTRONICS CORPORATION |
发明人 |
HUANG KUO-TAI;SIE WEN-YI;YOO TRI-REONG |
分类号 |
H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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