| 摘要 |
A method for making a three-dimensional device of the present invention includes a step for forming a cleaving layer 2, an intermediate layer 3, and a first transferred layer 41 on a translucent substrate 1 and for forming a cleaving layer 2, an intermediate layer 3, and a second transferred layer 42 on a translucent substrate 1, a step for bonding a substrate (transferring-side substrate) 21 to the side away from the substrate 1 of the transferred layer 41 with an adhesive layer 5 provided therebetween, a step for irradiating the cleaving layer 2 with illuminating light 7 so as to form intralayer and/or interfacial cleavage in the cleaving layer by ablation and for detaching the transferred layer 41 from the substrate 1 to transfer the transferred layer 41 onto the substrate 21, a step for bonding the transferred layer 41 to the side away from the substrate 1 of the transferred layer 42 with a conductive adhesive layer 22 provided therebetween, and a step for irradiating the cleaving layer 2 with the illuminating light 7 as above, and for detaching the transferred layer 42 from the substrate 1 to transfer the transferred layer 42 onto the transferred layer 41. <IMAGE> |
