CIRCUIT TAPE FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A circuit tape for semiconductor package is provided to prevent an inferiority of the semiconductor package by preventing glob top material from flowing to a solder ball land. CONSTITUTION: A polyimide layer(21) is formed and conductive circuit pattern(23) is formed on the polyimide layer(21). A cover coat layer(22) is laminated on the circuit pattern(23). A solder ball land(22a) for sticking a solder ball to the circuit pattern and a penetration hole(24) exposing a region where the wire is to be bonded are formed at the cover coat layer(22). A bond finger(23a) connected to the circuit pattern is formed out side of the penetration hole(24). And, a dam(6) is formed on the cover coat layer(22) for preventing glob top material from flowing, thereby preventing an inferiority of a semiconductor package.