CIRCUIT TAPE FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A circuit tape for semiconductor package is provided to prevent an inferiority caused by bus line by forming the bus line connecting all circuit patterns at a position where a region, the wire is to be bonded therein, is open. CONSTITUTION: A circuit pattern is formed between the first insulating film(22) and the second insulating film(23). A solder ball land(25) for sticking the solder ball to the circuit pattern is formed on the first insulating film(22). the region where wire is to be bonded is opened, and plural of bond finger(24)s are formed at the opened region. At the front end of the each bond finger(24), the bus line(26) for electroplating to be located in the vertical direction. The front end of the bond finger(24) is connected to the bus line by forming at the bus line in the narrow width to the width of the bond finger(24).