| 摘要 |
PURPOSE: A semiconductor device is provided to prevent the defective bonding of wires by making bonded wires easily optically recognizable. CONSTITUTION: The semiconductor device comprises a semiconductor chip (20) having a plurality of electrodes and leads (16) containing inner lead sections (16a) which are connected to the electrodes through wires (24) and outer lead sections (16b) which function as external terminals, wherein, in each inner lead section (16a), a groove (18) is formed as a central displaying section at the center of its bonding area for the wire (24) in the widthwise direction. |
