| 摘要 |
This invention relates to an acoustic surface wave device suitably used in a high-frequency circuit, in which high attenuation characteristics are provided. The present invention includes an acoustic surface wave element, a ceramic package having a ceramic substrate of a multi-layer structure, the ceramic substrate having a die-attach portion on which the acoustic surface wave element is mounted, the ceramic package having an input terminal and an output terminal connected to the acoustic surface wave element, the ceramic package having an opening located above the ceramic substrate, each of the input terminal and the output terminal having a ground terminal, and a metallic cap sealing the opening of the ceramic package. The metallic cap is electrically connected to one of the ground terminal of the input terminal and the ground terminal of the output terminal.
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