RESISTOR AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To allow the probe contact position in a trimming process to coincide with that in a resistance sizing process, and to stabilize the yield of a product by setting a second upper-surface electrode layer higher than a side-surface electrode layer. SOLUTION: A pair of lower- and upper-surface electrode layers 22 and 23 is provided at the lower- and upper-surface side parts of a substrate 21 by the mixing material of copper and glass. A resistance layer 24 is made of the mixed material of copper and Ni while being electrically connected to the upper-surface electrode layer 23, and an upper electrode layer 25 is made on the upper surface of the upper-surface electrode layer 23 while the layer 25 is separated from the side part of the substrate 21 while being superposed on one portion of the resistance layer 24. The upper-surface electrode layer 25 is positioned inside the substrate 21 as compared with the upper-surface electrode layer 23. Then, a trimming groove 26 is made in the resistance layer 24, and a protection layer 27 made of an epoxy resin is provided on an upper surface. The upper-surface electrode layer 23 is electrically connected to the lower-surface electrode layer 22, and at the same time a side-surface electrode layer 28 is formed of the mixed material of silver and phenolics on the side surface of the substrate 21 and the upper surface without the upper-surface electrode layer 25 of the upper-surface electrode layer 23 so that the side-surface electrode layer 28 becomes lower than the upper- surface electrode layer 25.