发明名称 |
Semiconductor element having a carrying device and a lead frame and a semiconductor chip connected thereto |
摘要 |
A semiconductor component has a semiconductor chip, connection elements, and a housing made of a molding compound. The semiconductor chip has contact pads on a top side. The contact pads are electrically connected to the connection elements via bonding wires. The connection elements overlap the semiconductor chip and they are affixed to the semiconductor chip with an adhesive tape. The adhesive tape has a carrier sheet of aluminum oxide and an adhesive layer applied on both sides of the carrier sheet.
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申请公布号 |
US6036173(A) |
申请公布日期 |
2000.03.14 |
申请号 |
US19980200070 |
申请日期 |
1998.11.25 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
NEU, ACHIM;JANCZEK, THIES;TUTSCH, GUENTER |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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