发明名称 |
Wiring board and semiconductor device |
摘要 |
A wiring board to be provided between a packaged electronic component having an integrated circuit and a mother board on which the packaged electronic component should be mounted, includes a base made of an insulating material, a first circuit pattern which is provided on a first surface of the base and has terminals connectable to terminals of the packaged electronic component for external connections, and a second circuit pattern which is provided on a second surface of the base opposite to the first surface thereof and has terminals connectable to terminals provided on the mother board.
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申请公布号 |
US6038135(A) |
申请公布日期 |
2000.03.14 |
申请号 |
US19960591119 |
申请日期 |
1996.01.25 |
申请人 |
FUJITSU LIMITED |
发明人 |
HIGASHIGUCHI, YUTAKA;INAGAKI, MITSUO;TOTANI, MAKOTO;TESHIMA, YASUHIRO |
分类号 |
H01L23/32;H01L23/538;H05K1/11;H05K1/14;H05K3/22;H05K3/34;H05K3/36;(IPC1-7):H05K1/18 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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