BOARD, SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To easily form projections of stable shape with respect to a board and a semiconductor device for use in information communication equipment and the like and a method for their manufacture. SOLUTION: When an electronic component 5 is mounted on the surface of a board 1, projections 3 formed in desired positions on a wiring pattern 2 formed on the board 1 and the electrode portions 6 formed on the electronic component 5 mounted on the board 1 are connected electrically with each other. By integrally and simultaneously forming the wiring pattern 2 and the projections 3 at this time, the projections 3 can be formed very simply and efficiently, and furthermore the projections 3 can always be formed readily with stable shape.