| 摘要 |
PROBLEM TO BE SOLVED: To better manufacturing efficiency and miniaturize a module in which components and a cap covering the surface mounted components are surface mounted on a substrate and its manufacturing method. SOLUTION: In an elastic surface wave module 20, filters 22, 23, a chip component 32, and a cap 14 covering them are mounted on a substrate 11, and an opening part 30 is provided in a side face of the cap 14 so as to observe the filters 22, 23 and the chip component 32 positioned in the cap from outside the cap. Thus, even if the filters 22, 23, the chip component 32, and the cap 14 are collectively mounted on the substrate 11 in order to better manufacturing efficiency, it becomes possible to inspect a mounted state of the filters 22, 23 and the chip component 32 after this mounting process.
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