| 摘要 |
PROBLEM TO BE SOLVED: To import an effective ultrasonic vibrations to a bonding portion, regardless of the size of bonding load. SOLUTION: A plurality of inner leads provided on a wiring tape 16 is bonded in batch to a plurality of bonding pads provided on a semiconductor chip 8 one to one by exciting the pads and leads in a state, where the pads and leads are held between a bonding stage 9 and a bonding tool 10, by means of a bonding device provided with the bonding stage 9 on which the semiconductor chip 8 is placed, the bonding tool 10 which is faced opposite to the stage 9, a loading base 14 for applying a bonding load, an ultrasonic vibrator 11, and a horn 12. The upper end section of the bonding tool 10, which is the contacting point of the bonding tool 10 with the loading base 14 is constituted, so that the section becomes a node section for ultrasonic standing wave.
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