发明名称 SEMICONDUCTOR LASER UNIT
摘要 PROBLEM TO BE SOLVED: To enable a part of a socket that protrudes towards the underside of a board to be lessened in size, by a method wherein a part of a resin molded part that protrudes towards the underside of an island is made to serve as a socket where the electric connecting plane of the outer leads of leas pins is exposed, and the lower part of the socket can be cut off. SOLUTION: In a socket 12, electrical mounting connecting surfaces are formed on the side faces of the outer leads of lead pins 4 arranged in parallel confronting each other, and electric connecting surfaces for a continuity test are provided to the lower edge faces of the outer leads, and a hollow 20 that is not filled up with resin is provided between the outer leads which confront each other in a lateral direction. Furthermore, a cutting groove 21 is provided to the cutting part of the lower part 12a of the socket part 12, a beam 22 is provided inside the hollow 20 in one piece by resin molding along a cutting line, and the lower part 12a of the socket 12 can be cut off along the cut groove 21. After mounting, the lower part of a socket is cut off, whereby a part of the socket protruding toward the underside of a board can be lessened in size.
申请公布号 JP2000077792(A) 申请公布日期 2000.03.14
申请号 JP19980245325 申请日期 1998.08.31
申请人 CHICHIBU FUJI:KK 发明人 TAKANO YOSHIHIRO;KOMATSU MASARU;TAKADA ISAMU;BONO KENJI
分类号 G11B7/125;H01S5/00;H01S5/022;H01S5/30 主分类号 G11B7/125
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