| 摘要 |
PROBLEM TO BE SOLVED: To provide an opening method of a resin-sealed type semiconductor device, which can expose a chip under the state wherein the electric connection of the chip and a lead are maintained, without breaking the chip and the lead and can accurately analyze the defective part of chip. SOLUTION: First, the resin-sealed type semiconductor device, wherein the specified region is covered by a Teflon (R) tape, is immersed in the fuming nitric acid of 55 deg.C. Thus, planned removing region of resin material is etched away (step 31). Then, the sample, where the island part is exposed, is immersed in the room-temperature mixed liquid of hydrochloric acid and nitric acid having the mixing rate of 1:1. Thus, the island part is removed (step 32). Thereafter, the sample, wherein the mounting material that is bonded to the substrate surface of the chip is exposed, is immersed in the room-temperature nitric acid. Thus, the mounting material is removed (step 33). Thereafter, the substrate surface of the exposed chip is polished to mirror surface (step 35).
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