Method of manufacturing photosensitive semiconductor device

摘要

The present invention provides a photosensitive semiconductor device comprising a sealing body composed of a resin material for sealing photosensitive semiconductor elemental devices, a inside of the sealing body having a light-transmissive property, a surface of the sealing body composed of the resin material containing carbon. Owing to the above-described construction, the present invention can provide a photosensitive semiconductor device which eliminates the need for a mold resin forming process for forming only a lightproof film and is capable of simplifying a manufacturing process thereof and being rendered compact in size.