| 摘要 |
PROBLEM TO BE SOLVED: To prevent the formation of damage and the like on the wiring pattern even in the case of the minute wiring pattern by removing the unwanted part of a seed layer by electrolytic separating means after the required wiring pattern is formed on insulating base material. SOLUTION: A bonding metal layer 6 such as chromium is uniformly formed on one surface of a required insulating base material 7. Furthermore, a seed layer 5 of copper and the like is formed on the surface of the bonding metal layer 6. Thereafter, the unncessary part of the seed layer 5 is masked by using photoresist and the like. Then, the signal layer or the different metal of the conductor of copper and the like is laminated and attached to the required part by an electrolytic plating means. Thus, required wiring pattern 4 is formed. Such a circuit board is arranged in an electrolytic bath 1, and the circuit board and a counter electrode 8 are connected to a DC power supply 9 and applied to the electrolytic separation process of the sheed layer 5, and the unwanted part is adequately removed.
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