| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-conduction member which can be applied even to an electronic device wherein the position relationship between a heating electronic part and a heat-dissipation member is complicated by, in the design for an electronic device, raising the freeness in position for setting the heat- dissipation member. SOLUTION: A heat-insulating layer 12 of formable resin, etc., is provided on both surfaces, side surface, and end surface so that a sheet-like heat- conductive base material 11 such as a copper or aluminum foil is covered. A part of the heat-insulating layer 12 is cut out, where a joint part 13 which is thermally contacted to an electronic device where the heat-conductive base material 11 is exposed or a heat-dissipation member is provided. Further, a heat-conductive joint layer 14 formed of a heat-conductive adhesive or solder, etc., is provided at the joint part 13, providing a heat-conduction member 10.
|
