发明名称 THERMAL PRESS-FITTING EQUIPMENT FOR COVERED WIRE
摘要 PROBLEM TO BE SOLVED: To eliminate removal work of adhered matters by adopting a heating method using a laser device instead of a power supply. SOLUTION: This thermal press-fitting device 10 comprises a laser device 11, a condensing lens 13 to converging a laser light 12 outgoing as a pulse from the laser device 11, a ribbon material 14 to be heated by the laser light, a ribbon guide to support the part 14a to be heated of the ribbon material 14, etc. To press-fit a covered wire 6 thermally, the covered wire 6 is placed on a part 5 to be joined first. Then the ribbon guide 15 is lowered until the part 14a is brought into contact with the covered wire 6. In this state, the laser light 12 as a pulse is emitted to the part 14a for heating, so that a solder 7 is melted, and the part 5 and a core wire 8 of the covered wire 6 are press- fitted thermally and they are connected with each other electrically.
申请公布号 JP2000077844(A) 申请公布日期 2000.03.14
申请号 JP19980249413 申请日期 1998.09.03
申请人 NIPPON AVIONICS CO LTD 发明人 ITO ATSUSHI
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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