| 摘要 |
PROBLEM TO BE SOLVED: To stably and reliabbly provide an electronic component bonding device, which can make the recovery of electronic components determined as defectives. SOLUTION: In a bonding device for bonding chips 9 on a chip-feeding part 3 on a substrate 7 by a bonding head 16, a chip sensor 22 for inspecting the state of the chips 9 on the way of transferring the chips 9 on the substrate 7 by the head 16 is provided and a box type-shaped chip recovery part 23 for collecting the chips 9 decided a defective by the inspection is provided under the lower part of a bonding head 16 transfer path. The recovery part 23 is provided with a scattering preventive means for preventing the fallen chips from scattering. Thereby, the fallen chips can be recovered surely.
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