| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe contactor that is used for testing semiconductor wafer, LSI package, printed-circuit board, and the like being formed on the flat surface of a substrate by a photolithography technique, and a method for forming a contactor. SOLUTION: The probe contactor is constituted of a substrate 220 with an interconnect trace that is a conductive passage on the surface, and a contactor 230 that is formed on the substrate 220 by the photolithography manufacturing method. The contactor 230 is provided with a base part that is formed upright for the substrate 220, a horizontal part where one end is formed on the base part, and a contact part that is formed at the other end of the horizontal part. When the contactor 230 is pressed against a part to be tested (a semiconductor wafer 300 to be tested), a contact pressure is generated by the horizontal part of the contactor 230. |
