PRINTED BOARD AND ELECTRONIC UNIT

摘要

PROBLEM TO BE SOLVED: To provide a printed board and the electronic unit, which can prevent the separation of a pad by external shock beforehand. SOLUTION: On this printed board 10, the electrode of a BGA semiconductor device is made to correspond to the surface of an insulator 11, and a square pad 12 is formed. The surfaces of the insulator 11 and the pad 12 are covered with solder resist 13, wherein an opening 13o is provided. This electronic unit is made to correspond to the electrode of the BGA semiconductor device. The square pad 12 is formed of the surface of the insulator 11. On the printed board 10, which is covered with the solder resist 13, wherein the opening 13o is provided, at the surfaces of the insulator 11 and the pad 12, the BGA semiconductor device as the electronic component is mounted.