| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder ball mounting equipment, a method for mounting a solder ball and an arranging jig used therefor by which a solder ball can be sucked onto the mounting head surely and easily, and it can be also mounted to works such as a printed board, etc., quickly and accurately. SOLUTION: This equipment is used to mount a solder ball 65 to a printed board 66 placed on a mounting equipment 70. It consists of an arranging jig 2 to arrange solder balls, a solder ball supply equipment 31 to supply the solder ball thereto, a recovery equipment 4 to recover excessive solder balls, a mounting head 5 to suck the solder ball on the arranging jig and transfer it to a printed board on the mounting equipment, and an arranging table 3 on which one or a plurality of arranging jigs are placed. The recovery device 4 is provided with a storing container 41 to store the recovered solder balls and a gas carrying means 42 to carry the solder ball therein to the solder ball supply equipment 31 again by means of a gas fluid.
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