| 摘要 |
PROBLEM TO BE SOLVED: To obtain a board material for printed circuit, which secures an excellent electric continuity, can control the thermal expansion property so that the board material and the conducting layer and the insulating material and a metal wire are not separated in use and has an excellent high deisity and the dimensional accuracy. SOLUTION: Facing both side-wall parts 22 and a box-type frame main body 10 whose upper part is opened are used. A wire holding member 11 having the wire containing groove at the specified pitch is provided at the upper surface. Thereafter, a wire 14 is bridged in the tensile state in the wire containing groove of both side wall parts 22. Then, the wire holding member 11 is overlapped on the wire holding part 11 sequentially, and both side wall parts 22 are formed, and the metal mold is constituted. At the same time, a wire 14 is provided between both side wall parts 22. Thereafter, the composite material comprising plastic and ceramic is flowed into the die. After the composite material is hardened, the wire holding member 11 is removed, and the hardened composite material is obtained. This hardening composite material is sliced so as to cross the wire 14. This is the manufacturing method of the substrate material for the printed circuit.
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