| 摘要 |
Wafer handling apparatus includes a plurality of holding stations arranged in an upstream-to-downstream order and devices to treat the wafers held at the stations. Cyclically operative wafer shifting devices engage the wafers, simultaneously remove the engaged wafers during that cycle from the holding stations, shift the engaged wafers downstream relative to said holding stations and then simultaneously redeposit the wafers onto the holding stations. Thus, each wafer redeposited on a cycle of the wafer shifting devices is disposed at a holding station downstream from the holding station occupied by such wafer before that cycle of the shifting devices. Wafer supply and removal devices are provided for introducing and removing the wafers to and from the holding stations after they are treated. A method of handling wafers among a plurality of holding stations is also disclosed.
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