SELF-DESTRUCTIVE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reliably prevent juggling memory contents of a semiconductor integrated circuit. SOLUTION: An external connecting electrode pad and a power supply source connecting electrode pad are provided in an IC chip 12a and an electrode base 32, and the IC chip 12a is flip-chip-mounted on the electrode base 32. A plus polarity connection lead 28a is provided in a power supply source 6, which is mounted on a rear face of the IC chip 12a. A connection lead 28a is jointed to an electrode pad 64, and a metal thin film 29 is jointed to an electrode pad 64b, and an electric connection between the power supply source 6a and the electrode base 32 is attained.