| 摘要 |
<p>PROBLEM TO BE SOLVED: To dispense with a process, in which a dam is formed to prevent sealing resin from flowing out by a method wherein thermosetting liquid sealing resin is heated, together with a circuit board and cured, a resin frame is dismounted from the cured sealing resin, and a semiconductor chip and bonding wires are sealed up with resin. SOLUTION: A resin frame 8 of fluororesin or the like which is high in releasability is mounted on a circuit board 2, surrounding a region where a semiconductor chip 3 and bonding wires 4 are located. Thermosetting liquid sealing resin 5 is made to flow by natural diffusion inside the resin frame 8, whereby the semiconductor chip 3 and the bonding wires 4 are covered with the sealing resin. Thereafter, the liquid sealing resin 5 is heated together with the circuit board 2 to be cured, the resin frame 8 is dismounted from the cured sealing resin 5, and thus the semiconductor chip 3 and the bonding wires 4 are sealed with sealing resin.</p> |
